Chemical Etching Formula
TA1 commercially pure titanium with HF(5%)+HNO₃(30%)

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

Why HF(5%)+HNO₃(30%) for TA1 commercially pure titanium?

Hydrofluoric/nitric formulas are used for refractory and titanium-family metals such as TA1 commercially pure titanium because the fluoride ion is one of the few species that will break down their tenacious passive oxide. The nitric component oxidizes the freshly exposed metal so the fluoride can keep working. Handling demands are high, but for TA1 commercially pure titanium there is rarely a practical alternative.

Process Window & Bath Control

The process window for this HF(5%)+HNO₃(30%) formula centres on 32°C and as specified. Conveyor speed spans 0.12-30.76 m/min over the 0.01-0.5 mm thickness band; the typical operating point is 0.61 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 8-600 μm and the minimum line width ranges 100-500 μm across the 0.01-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 1-106 μm, and the etch factor is about 2.35. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Yield & Production Economics

Typical mass-production yield for TA1 commercially pure titanium in the HF(5%)+HNO₃(30%) system is 95.3%, within an observed range of 94.2-95.5%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

TA1 commercially pure titanium etched with this recipe typically ends up in medical implants, surgical instruments, aerospace brackets, and corrosion-resistant filters. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

Process Equipment & Material Reference

Production of TA1 commercially pure titanium parts using the HF(5%)+HNO₃(30%) formula described above runs on a biomedical blade etching machine configured for through etch (double-sided). The bath chemistry, conveyor speed, and rinse cascade detailed on this page reflect the operating profile we use on a live spray-etching line for this alloy.

Related to this formula, the Titanium chemical etching guide page documents the full process envelope for the same alloy family, including pre-treatment chemistry and post-etch inspection criteria.

Production Use Cases for This Formula

Typical end-uses for TA1 commercially pure titanium run on this formula include stainless steel shower-head filter mesh, tea-infuser custom filter etching, and stainless steel metal filter mesh. The 32°C bath and 0.01-0.5 mm supported thickness range cover most of the production work in these segments without re-tuning chemistry.

Designs that sit slightly outside this thickness or feature-size envelope are usually addressable by a sister formula in the same etchant family. The bath chemistry stays the same; the tuning shifts to conveyor speed and resist choice.

Other Metals Etched with HF(5%)+HNO₃(30%)

The HF(5%)+HNO₃(30%) chemistry is also documented for these alloys.

More Titanium Alloys Formulas

Other formulas in the same material family.

Frequently Asked Questions