Titanium Alloys HF(5%)+HNO₃(30%)

Chemical Etching Formula
TA1 commercially pure titanium with HF(5%)+HNO₃(30%)

For engineers selecting an etching chemistry for TA1 commercially pure titanium, the HF(5%)+HNO₃(30%) formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.01-0.03 mm thickness band. Typical mass-production yield for this recipe is 96.0%, with a typical conveyor speed of 7.75 m/min at 30°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

HF(5%)+HNO₃(30%) Etchant System
°Bé Concentration
1.180 Specific Gravity
30 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.01-0.03 mm Thickness Range
0.02 mm Typical Thickness
4.43-15.44 m/min Conveyor Speed Range
7.75 m/min Typical Speed
15-30 μm Min Hole Ø Range
100 μm Min Line Width Range
46086 μm Undercut Range
2.38 Etch Factor (EF)
96.0% Typical Yield (96%)

Why HF(5%)+HNO₃(30%) for TA1 commercially pure titanium?

For TA1 commercially pure titanium, the HF/HNO₃ blend works where chloride chemistries stall: fluoride dissolves the stable oxide, nitric acid re-oxidizes the metal, and the two cycle to give a steady etch. Concentration and temperature control are critical here because the rate is strongly chemistry-dependent.

Process Window & Bath Control

The process window for this HF(5%)+HNO₃(30%) formula centres on 30°C and as specified. Conveyor speed spans 4.43-15.44 m/min over the 0.01-0.03 mm thickness band; the typical operating point is 7.75 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 15-30 μm, line width 100 μm, single-side undercut 46086 μm — all as a function of thickness across 0.01-0.03 mm. The higher the etch factor (this formula holds about 2.38), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 15-30 μm
• Minimum line width range: 100 μm
• Single-side undercut range: 46086 μm
• Typical etch factor (EF): 2.38

Yield & Production Economics

Expect a yield in the 96% range for TA1 commercially pure titanium with HF(5%)+HNO₃(30%), with 96.0% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

TA1 commercially pure titanium etched with this recipe typically ends up in medical implants, surgical instruments, aerospace brackets, and corrosion-resistant filters. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Titanium Alloys Formulas

Other formulas in the same material family.

Frequently Asked Questions

Standard pre-treatment is degrease, micro-etch to activate the surface, rinse, photoresist lamination or coating, UV exposure through the artwork, and develop. Pre-treatment quality directly drives yield for TA1 commercially pure titanium: poor degreasing causes resist adhesion failures that show up as random pinhole defects in the etched pattern.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the HF(5%)+HNO₃(30%) chemistry. Send us your part drawing and quantity for a full process quote.