Titanium Alloys HF(5%)+HNO₃(30%)

Chemical Etching Formula
TA2 commercially pure titanium with HF(5%)+HNO₃(30%)

Working with TA2 commercially pure titanium on a chemical etch line begins with the right formula. The HF(5%)+HNO₃(30%) system documented below produces through etch (double-sided) across 0.05-0.5 mm sheet, with a minimum hole-diameter range of 60-600 μm and a minimum line-width range of 100-500 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

HF(5%)+HNO₃(30%) Etchant System
— °Bé Concentration
1.180 Specific Gravity
33 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.5 mm Thickness Range
0.18 mm Typical Thickness
0.12-1.36 m/min Conveyor Speed Range
0.17 m/min Typical Speed
60-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
11-107 μm Undercut Range
2.33 Etch Factor (EF)
95.1% Typical Yield (94.2-95.4%)

Why HF(5%)+HNO₃(30%) for TA2 commercially pure titanium?

For TA2 commercially pure titanium, the HF/HNO₃ blend works where chloride chemistries stall: fluoride dissolves the stable oxide, nitric acid re-oxidizes the metal, and the two cycle to give a steady etch. Concentration and temperature control are critical here because the rate is strongly chemistry-dependent.

Process Window & Bath Control

Hold the bath at 33°C with concentration as specified (specific gravity 1.180). Across the 0.05-0.5 mm thickness range, conveyor speed runs from 0.12-1.36 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.17 m/min for 0.18 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-600 μm and the minimum line width ranges 100-500 μm across the 0.05-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 11-107 μm, and the etch factor is about 2.33. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 11-107 μm
• Typical etch factor (EF): 2.33

Yield & Production Economics

Typical mass-production yield for TA2 commercially pure titanium in the HF(5%)+HNO₃(30%) system is 95.1%, within an observed range of 94.2-95.4%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

TA2 commercially pure titanium etched with this recipe typically ends up in medical implants, surgical instruments, aerospace brackets, and corrosion-resistant filters. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Titanium Alloys Formulas

Other formulas in the same material family.

TA1 commercially pure titanium HF(5%)+HNO₃(30%) Through etch (double-sided) TA1 commercially pure titanium HF(5%)+HNO₃(30%) Through etch (double-sided) TA1 commercially pure titanium HF(5%)+HNO₃(30%) Half etch (single-sided) Ta1 Pure Tantalum HF(8%)+HNO₃(30%) Through etch (double-sided) TA3 commercially pure titanium HF(5%)+HNO₃(30%) Through etch (double-sided) TC1 Titanium Alloy HF(5%)+HNO₃(30%) Through etch (double-sided)

Frequently Asked Questions

Single-side undercut ranges 11-107 μm depending on thickness and dwell time. When sizing the photomask for a finished feature on TA2 commercially pure titanium, subtract twice the expected undercut from the target width so the etched dimension lands on specification.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the HF(5%)+HNO₃(30%) chemistry. Send us your part drawing and quantity for a full process quote.

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